The Effect of Environmental Aging for Performance of Underfill

doi:10.12146/j.issn.2095-3135.20200927001

Home > Archive>Volume 10, Issue 1, 2021 >47-54. DOI:10.12146/j.issn.2095-3135.20200927001

The Effect of Environmental Aging for Performance of Underfill
DOI:
                        10.12146/j.issn.2095-3135.20200927001
                    
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                        YANG YuanyuanYANG Yuanyuan
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518056, China；
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LI GangLI Gang
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518057, China；
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ZHU PengliZHU Pengli
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518058, China；
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ZHANG ChaoZHANG Chao
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518059, China；
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WU HouyaWU Houya
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518060, China；
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PENG XiaohuiPENG Xiaohui
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518061, China；
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SUN RongSUN Rong
Shenzhen Institute of Advanced Electronic Materials, Shenzhen? 518103, China；Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen? 518062, China；
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WONG ChingpingWONG Chingping
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta? 30332, USA; Department of Electronics Engineering, the Chinese University of Hong Kong, Hong Kong? 999077, China
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Fund Project:National Key R&D Project from Minister of Science and Technology of China (2017YFB0406000)

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Abstract:

The reliability of solder joints is one of the key concerns in electronic packaging. Underfill was employed to match the thermal expansion coefficient between the substrate and the IC chip in electronic packaging, thereby protecting the solder joints and improving the reliability of the solder joints. However, the reliability of solder bumped flip chip will be affected by the changes in performance of underfill during the aging process. Therefore, the effects of several aging treatments on the thermo-mechanical properties and adhesion of underfill were studied in this paper. The thermo-mechanical properties of the underfill have the most obvious changes after hydrothermal aging treatment and high-temperature storage life treatment. There is no obvious similarity on organic interface and the inorganic interface for adhesion of underfill. High temperature storage has the most obvious effect on the adhesion of inorganic interfaces, while hydrothermal aging has the most obvious effect on the organic interfaces.

Key words:environmental aging; underfill; electronic packaging

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YANG Yuanyuan, LI Gang, ZHU Pengli, et al. The Effect of Environmental Aging for Performance of Underfill[J]. Journal of Integration Technology,2021,10(1):47-54

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Online: January 26,2021
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